By Naveed A. Sherwani, Siddharth Bhingarde, Anand Panyam
This key textual content addresses the advanced computing device chips of the next day on the way to encompass numerous layers of steel interconnect, making the interconnect inside of a chip or a multichip module a 3 dimensional challenge. you will find an insightful method of the algorithmic, telephone layout concerns in chip and MCM routing with an emphasis on thoughts for removing routing quarter.
Read Online or Download Routing in the Third Dimension: From VLSI Chips to MCMs (IEEE Press Series on Microelectronic Systems) PDF
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Additional resources for Routing in the Third Dimension: From VLSI Chips to MCMs (IEEE Press Series on Microelectronic Systems)
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